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Alfred***Chúng tôi nhận được hàng hóa, mọi thứ đều ổn. Bao bì hoàn hảo, chất lượng sản phẩm tốt, giá tốt - chúng tôi hài lòng. -
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Matthew***Tôi mua hợp kim mở rộng thấp từ Joy, cô ấy là một người phụ nữ rất có trách nhiệm, chất lượng sản phẩm của Huona khá tốt.
0.05mm Diameter Silver-Plated Copper Wire With Anti-Oxidation & Corrosion-Proof For Precision Electronics
| Nguồn gốc | Trung Quốc |
|---|---|
| Hàng hiệu | HUONA |
| Chứng nhận | ISO9001, RoHS |
| Số mô hình | Dây đồng mạ bạc |
| Số lượng đặt hàng tối thiểu | 10kg |
| Giá bán | Need to negotiate |
| chi tiết đóng gói | Thùng Carton/Gỗ |
| Thời gian giao hàng | 10-25 ngày làm việc |
| Điều khoản thanh toán | L/C,T/T, Công Đoàn Phương Tây |
| Khả năng cung cấp | 100 tấn/tháng |
Liên hệ với tôi để lấy mẫu miễn phí và phiếu giảm giá.
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xThông tin chi tiết sản phẩm
| Tên sản phẩm | Dây đồng mạ bạc | vật liệu mạ | Bạc nguyên chất |
|---|---|---|---|
| Đường kính | 0,05mm (± 0,003mm) | Độ dày lớp mạ | 0,5–3,0μm |
| Độ giãn dài | ≥15% | Độ dẫn điện | ≥105% IACS (20°C) |
| Nhiệt độ hoạt động | -60°C đến +200°C | MOQ | 10kg |
| Làm nổi bật | Silver-Plated Copper Wire,0.05mm,High-Conductivity |
||
Mô tả sản phẩm
Product Description
0.05mm High-Conductivity Silver-Plated Copper Wire
High-performance fine conductor for precision electronic components, featuring a high-purity oxygen-free copper core with uniform silver plating for superior electrical performance.
Product Overview
Silver-plated copper wire (0.05mm diameter) from Huona New Material is a high-performance fine conductor composed of a high-purity oxygen-free copper (OFC) core and a uniform, dense silver plating layer. Manufactured through precision drawing and continuous electroplating processes, this 0.10mm wire delivers excellent electrical conductivity, superior oxidation resistance, and reliable solderability. With a diameter tolerance of ±0.003mm and plating thickness of 0.5-3.0μm, it is widely used in high-frequency signal transmission, miniaturized electronic components, and aerospace wiring applications.
Standard Designations & Core Material Foundation
- Base Material: High-purity oxygen-free copper (OFC, ≥99.99%)
- Plating Material: 99.9% pure silver
- Key Specification: 0.05mm diameter (tolerance ±0.003mm)
- Plating Thickness: 0.5-3.0μm (customizable)
- Compliant Standards: ASTM B500, GB/T 4910, IEC 60884
- Manufacturer: Huona New Material, certified to ISO 9001 and IATF 16949
Key Core Advantages
High Conductivity & Signal Integrity
- Enhanced Conductivity: Silver's conductivity (63×10⁶ S/m) is higher than copper, reducing signal loss in high-frequency applications. The 0.10mm diameter balances conductivity and flexibility, making it ideal for high-speed data lines.
- Low Contact Resistance: The silver plating ensures stable, low-resistance connections in connectors and switches, even after repeated mating cycles.
Excellent Oxidation & Corrosion Resistance
- Silver Protective Layer: The dense silver coating prevents copper oxidation at high temperatures or in humid environments, maintaining long-term conductivity stability.
- Corrosion Resistance: Resists sulfurization and most chemical corrosion, suitable for harsh environments such as aerospace and industrial control systems.
Good Mechanical Properties & Processability
- Ductility & Flexibility: Elongation ≥15% (annealed) allows bending and winding on small mandrels (≥0.2mm) without breaking, suitable for fine-pitch components.
- Uniform Plating: Advanced electroplating technology ensures a smooth, consistent silver layer with no peeling or blistering, even after drawing and annealing.
Technical Specifications
| Attribute | Value (Typical) |
|---|---|
| Base Material | Oxygen-Free Copper (OFC) |
| Plating Material | Pure Silver |
| Diameter | 0.05mm (±0.003mm) |
| Plating Thickness | 0.5-3.0μm |
| Tensile Strength | 380-500 MPa (Hard Drawn); 220-300 MPa (Annealed) |
| Elongation | ≥15% |
| Conductivity | ≥105% IACS (20°C) |
| Operating Temperature | -60°C to +200°C |
| Surface Finish | Bright silver, smooth, oxide-free |
Product Specifications
| Item | Specification |
|---|---|
| Supply Form | Spools (100m/500m/1000m per spool) |
| Plating Type | Soft silver plating (for soldering) or hard silver plating (for wear resistance) |
| Packaging | Vacuum-sealed bags + anti-static packaging + outer carton |
| Customization | Diameter (0.02-0.5mm); plating thickness; pre-tinning |
Typical Application Scenarios
- Miniaturized Electronics: Fine-pitch connectors, flexible circuits, and bonding wires for smartphones, wearables, and medical devices.
- High-Frequency Communication: RF cables, antenna elements, and microwave components requiring low loss and high conductivity.
- Aerospace & Defense: Lightweight wiring harnesses, sensor leads, and high-frequency signal lines in aircraft and satellite systems.
- Automotive Electronics: Sensor wires and high-speed data lines in ADAS and infotainment systems.
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